| Time |
Topic
|
| 09:30-09:40 |
Welcome Speech |
| 09:40-10:10 |
Guest Keynote - Dr. Kuo Wu, Deputy
Director of Design Service Division, TSMC |
| 10:10-10:40 |
Keynote - Daniel Yang, PacRim Managing
Director, Mentor Graphics |
| 10:40-10:50 |
Break |
10:50-11:25
 |
| Improve Your Productivity with Calibre TVF |
|
In the nano-era, physical verification becomes much
more challenge. Not only because the number of design
rules explodes dramatically, there are also a lot
of new problems we need to handle such as the manufacturability
issues. Mentor provides Calibre TVF (Tcl Verification
Format) for use in coding Calibre rule files. It could
help you to reduce the effort of rule file creation
and maintenance, and also help you easily customize
your rule checks. In this paper, we would like to
share some of our experiences of Calibre TVF. Let’s
enjoy TVF, now.
|
| 11:25-12:00 |
| Dramatically reducing DRC
run time by using Incremental DRC |
|
In nanometer technology, thousands of design rules
will be checked and more and more iterations will
be requested before signoff our design. The DRC run
time could be dramatically increased from couple of
hours to couple of days. Think about this, if you
can real time get the DRC results and then correct
those errors with the instruction of Calibre DRC to
avoid creating new errors before the whole design
DRC finished, waiting will not be the only thing you
can do. Calibre incremental DRC inclues complete flow,
design delta flow and previous result flow to provide
more convenient and easier GUI to achieve the reduction
of DRC run time in different purposes. We would like
to introduce the concept of Calibre incremental DRC
and share some sucessful experiences in ruducing our
DRC run time by using Calibre incremental DRC and
also some suggestions that need to be improved.
|
| 12:00-13:30 |
Lunch |
| 13:30-14:05 |
| Macro Model vs. Calibre
xRC |
|
1. Macro Model in VIS
2. Why to use Macro Model
3. Calibre xRC & post-simulation
4. Customers' concerns in Macro Model
5. Conclusion
|
| 14:05-14:40 |
| Review of post OPC checking;
Why do we need post OPC check? |
|
|
| 14:40-15:15 |
| Application
and Yield Estimation - Using Calibre Yield Analyzer
for Critical Area Analysis in Layout |
|
Application and Yield Estimation - Using Calibre
YieldAnalyzer for Critical Area Analysis in Layout
Critical Area Analysis estimates random defect impact
on a design, which becomes more sophisticated compared
to other DFM fields in these days.
On the other hand, to have a methodology which can
estimate design quality in manufacturing aspect becomes
a strong demand from fabless IC design houses.
This presentation introduce UMC's experience for Mentor
Calibre YieldAnalyzer CAA. We are glad to share with
everyone and exchange ideas and thoughts by this opportunity.
And we are going to present a practical CAA system
and share the experience regarding how we build up
the system. It includes fab data calibration, model
selection, cell-level CAA, and service flow setup.
With comprehensive index generated by the system,
IC design houses can assess the random defect impact
on a product, proceeding neceesary enhancement or
forecast.
|
| 15:15-15:35 |
Break |
| 15:35-16:10 |
| ADiT VPI Application on Thermal Sensor |
|
Because the volume of portable application increasingly small and for saving the cost, the more and more system integrated the analog and the digital circuits on the identical chip. And system on chip has become the future tendency. Therefore how to verify the mixed-signal design correctly and quickly is the important topic. The presentation will take thermal sensor as example to introduce the mixed-signal design flow, and will use ADiT VPI tool to verify the mixed-signal design.
|
| 16:10-16:45 |
| At-speed Test on a Design with Multi-clock Domain |
|
At-speed test is becoming more and more popular, and handling multiple clock domains and pattern number
reduction are two of its challenges. This paper describes
a case study of how Mentor Graphics TestKompress was
used successfully on a large video chip with 5 different
clock domains to test for both transition and stuck-at
faults. On-chip modified PLL clock generation circuit
and individual clock enabling/disabling scan cell
are used to control the multiple clock domains during
at-speed testing. In addition, some features of TestKompress
like mode definition in the test procedure file and
merger flow are shown in this paper, which are used
to reduce the pattern number while maintain the test
coverage.
|
| 16:45-17:20 |
| Methodology for Improving
Scan Diagnosis Resolution of Bridging Defect |
|
The goal of this paper is to improve scan diagnosis
resolution of bridging defect by finding possible
net pairs within a design which are likely to have
bridge defect and generating patterns for bridging
candidates. The flow mentioned here-in includes net
pair identification with Calibre, deterministic bridging
ATPG with FastScan and TestKompress, and scan diagnosis
with YieldAssist. Test vehicle is a real design in
silicon on 90nm technology node, with manual bridging
fault injection, the actual fault can be correctly
identified with high confidence score.
|
| 17:20-18:30 |
|
| 18:30-20:00 |
|